Aquabond Knowledge Base

PROCESS DATA SHEET

Introduction:       The AQUABOND™ Hot Aqueous Soluble Adhesive and Bonding Films have excellent bond strength and are designed to adhere to a wide range of substrates.  They are used to hold substrates in place during slicing, dicing, polishing, and lapping processes.  The adhesives are maintained without incident when exposed to both aqueous and solvent systems.  They can be exposed to temperatures as high as 50-60C without change.

Substrate Preparation:          The substrate should be clean and free of oily residue, soils, and moisture.  Surfaces should be dry before applying adhesive.

Handling of Adhesive:         No special safety precautions or gloves are necessary.  AQUABOND™ materials are safe and designed for easy handling.  The adhesive film and resin can be handled manually without causing problems in its processing.

Application:        The adhesive film may be cut to the desired dimensions and inserted between the substrates to be bonded.  The substrate "package" should then be heated to the appropriate bonding temperature, normally between 120-140C.  Pressure may be applied during heating to ensure the resin penetrates substrate pores.  The substrate is then allowed to cool for 30 min – 1 hr.

Adhesive resin is applied by heating the material to its melted form.  The resin can be delivered in a variety of methods including:

a) Hot plate or oven;

b) Heated pot or kettle + pouring;

c) Injection or purge through a hot melt gun.

After adhesive is allowed to cool, the product is ready for processing.

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