Loading...
Changes Saved.
Error Occurred!
AQUABOND TECHNOLOGIES DATABASE, AQUABOND APPLICATION BULLETINS, AQUABOND PROCESS DATA SHEETS - Aquabond 85 Aquabond 65 Aquabond 55 quartz wafer dicing temporary mounting temporary bonding
HOME - THERMOPLASTICS - CLEANING AGENTS - AQUACLEAN 500™ - APPLICATIONS - PRICING - PRODUCT DATA - DISTRIBUTORS - DATABASE - CONTACT

If You Are Losing Parts

 

Cleaning Before Bonding

 

If you are bonding your workpiece to a GLASS substrate and you are losing parts during your dicing process (after rotating 90°) you probably have bonded your work piece to a substrate that is either oily or has been cleaned in alcohol or acetone.  Most chemicals will leave organics behind and the Aquabond will not fully cure after you have applied your work piece to the puddle.

 

Give your bonding substrates a bath in hot water and a 2% solution of Aquaclean 900™  and then rinse in hot water.  This will ensure there is not a chemical residue on them.

 

 

Piezo bonded to glass substrate after singulation

 

Aquabond is a VOC free solution for your bonding/debonding process without sacrificing bond strength or integrity.  Using Alcohol or other chemcials with Aquabond will not give optimum results.




1

Add Comment

Please also verify yourself by typing the text in the following image into the box below it.

Related Articles



Aquabond Technologies™ . 5235 Mission Oaks Boulevard #300, Camarillo, California 93012