2. Diamond Blade Setup and ProcessAspect RatioAspect Ratio is the blade thickness to blade exposure ratio (exposure ÷ thickness = aspect ratio) for the highest cut location accuracy, the following guidelines can be used: Resin Bond = 10-1 Metal Bond = 15-1 Nickel Bond = 20-1
Blade Dressing
This is a process of preparing the blade for cutting, typically done with a vitreous or resin bonded silicon carbide or aluminum oxide abrasive dressing sticks, plates or boards. this process erodes back some of the bonding material, thus exposing the abrasive particles. Dressing is also used to remove imbedded grinding residue (swarf) as part of the cutting process (in process dressing).
Blade TruingMachining of the periphery of the blade to run concentric to the axis of rotation of the spindle and/or to adjust/ maintain the geometry of the blade.
CoolantThe selection and application of coolant is critical to the performance of any wet grinding process. This includes not only the quality of the water used but also the type of additive (if any). Additives can contain elements such as lubricants, surfactants and biocides, all of which can have dramatic effects the grinding process.
Kerf WidthThis is the actual width of the slot, generated by the abrasive blade. It is generally, fractionally wider than the statically measured blade thickness. The actual kerf width is dependant on many factors, some of which are: Blade exposure, Blade thickness, Blade axial run-out and material the being cut (fig. #3).
Land / Part WidthThis is the area within the inside edges of successive Kerfs (fig. #3). In a Gang stack, this is the spacer thickness plus the Blade thickness less the Blade run-out.
PitchThis is the Kerf width, plus the Land width. An individual Pitch is one Kerf plus one land. A Cumulative Pitch is a summation of a series of individual Pitches. A Gang of abrasive blades and Spacers are typically stacked to maintain a non-cumulative pitch specification (fig. #3).
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