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AQUABOND TECHNOLOGIES DATABASE, AQUABOND APPLICATION BULLETINS, AQUABOND PROCESS DATA SHEETS - Aquabond 85 Aquabond 65 Aquabond 55 quartz wafer dicing temporary mounting temporary bonding
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Bottom Side Chipout

An interesting application.  One customer has used the AQUABOND 85 to bond parts, then drilled holes nearly through the part, filled the holes with the AQUABOND 55 adhesive, and lapped the backside to the holes.  This prevented the chipping of the holes which would have occurred had the hole had been drilled entirely though the part in one step.  Use of the AQUABOND 55 prevented chipping.  This technique will work for most single crystal materials.




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