Ceramic Package ArrayOBJECTIVE
Develop a process to dice ceramic package arrays. Blade breakage is a common problem with current process. Currently using the following parameters: Blade: Disco resin-bond, 58 x .250 x 40mm Exposure: .150” Speed: 30,000 rpm Feedrate: 0.2 IPS (12 IPM)
SPECIFICATIONS
Part Size: .238 x .265 +/-.005”
OUTLINE
A metal bond blade was chosen to maximize stiffness. A blade thickness of .007” was tested, although a full .010” thickness would have been optimal: Feedrates up to 12 IPM were evaluated, but 5 IPM proved to be the maximum capability of this blade.
Table 1 Test Parameters
RESULTS
Table 2 Test Results
CONCLUSIONS
Part size was well within specification, as shown in Table 2.
Feedrates may be increased if the blade thickness is maximized to .010”.
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