Aquabond Knowledge Base

Machine

Cantilevered Dicing Saw such as MTI-250 or MTI-180

No. of Blades for Filter Dicing

5 to 10; For gang slicing lapped parts mounted on tape, 2x pitch spacing between diamond blades is recommended.

Blade P/N and Bond Type

Metal Bond

Blade Size OD x TH x ID

114.3 x 0.125 x 88.90 mm

No. of Blades for Pie Slicing

1

Blade P/N and Bond Type

Resin Bond 1A1R

Blade Size OD x TH x ID

125 x 0.762 x 69.875 mm

Spindle Speed

5000 RPM (Pie Slice) 9000 RPM (Filter Dicing)

Feed – Rate

12.7mm to 25.4mm/minute depending on Material type and Chipping Specification.

Blade Exposure

An 18:1 exposure: thickness ratio (2.30 mm exposure/0.125 mm blade thickness) is used to allow for penetration into the mounting substrate while minimizing spacer clearance and blade wear.

Cut Direction

Climb Cut

Material and Size

BK-7 or WMS-2 Optical Glass 0.95 ~ 1.0mm thickness

Material Orientation

Coated-side up

Bonding

AquaBond 65 (bonded parts)

Furukawa UC-120M-120 Tape (taped parts)

To achieve optimum cut geometry and edge quality the correct bonding technique must be based on total flatness across the lapped surface of the glass part. Based on an approximate surface area of 15 mm², and part out-of-flatness less than 0.005 mm, UV adhesive tape mounting is preferred; for part out-of-flatness greater than 0.005 mm, and/or parts too warped to allow for tape bonding, a water soluble temporary adhesive must be used. AquaBond 65 based on its bonding uniformity and conformance to warped surfaces, and its ability to quickly dissolve in a warm, aqueous solution of AquaClean 900 is recommended

Cut Depth into Mounting Substrate

0.254 mm [glass substrate for bonded parts]

Holding Fixture

150 mm OD Porous Ceramic Vacuum Chuck

Initial Dressing Cycle

Dressing Stick, ½ x ½ x 6”

(20) 1/2” long passes @ 2500 RPM / 100 mm/min

1.50 mm depth of cut

In-process Dressing

Yes

Coolant

19° C Syntilo/DI water, 2.5% Concentration

@ 1.5 to 3.5 GPM depending on number of blades.