DWDM Dicing Process Outline
TYPICAL SPECIFICATION:
Material: F7 soda-lime glass BK-7 borosilicate glass WMS-13 glass Part Size: 1.4 +/-0.1mm sq. Part Thks: 0.95 to 1.0 +/-0.05mm Max. Chippage: .050 to 0.2mm
OUTLINE: Bonding: The choice of bonding techniques depends upon the flatness of the glass wafer. The wafers are typically too warped to allow tape bonding. The solution is to bond with a hot water-soluble adhesive. The Aquabond 65 is readily dissolvable in hot, aqueous solution of Aquaclean 900. The only parts that can successfully be cut on tape were wafers that are approximately 15mm square and are warped less than 5m. Note also that gangs for tape-dicing should blades spaced at least two pitches apart.
Table 1 Test Parameters
Machine MTI 612 dual supported arbor Gang Wheels Metal Bond (Contact us for specifics) Size 4.5 x .005 x 3.501” Gang Pitch .0601” Spindle Speed 9000 RPM Feedrate 60 mm/min Wheel Exposure .090” Cut Direction Climb Cut Material Optical glass, .95 to 1.0mm thk Material Orientation Coated-side up Bonding Aquabond 65 Depth of Cut .010” into glass substrate (bonded parts) Fixture 8” dia. porous ceramic vacuum chuck Initial Dressing Cycle Dressing Stick, ½ x ½ x 6” (20) 1/2” lg. passes @ 2500 RPM / 4 IPM .060” D.O.C In-process Dressing None Coolant 19°C Syntilo/DI water, 2.5% conc. @ 1.5 GPM thru single .15” ID nozzle
TYPICAL RESULTS:
Table 2 Test Results
1
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