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I would like to know the current wafer dicing blade dressing process. Can you please enlighten me? Thanks.

Dressing routines depend on the process and unique variables.

1.  Material being cut

The reason you are looking for a dressing routine is to keep the blade square and diamond in the blade from loading up.  The material being cut affects loading as well as the adhesive being used for holding the part.

2.  Diamond blade

      a.  size (2 inch or 4.5?)

      b.  diamond size and concentration

      c.  resin, metal, nickel bond?

3.  Speed and feed on the dicing saw

4.  Acceptance critera for the parts being diced

The above are some of the main variables that are to be considered when developing a production dressing routine.




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