Quartz Wafer DicingQuartz Wafer Dicing OBJECTIVE
Demonstrate gang dicing process on 25mm sq. x .17mm thk. quartz wafers using Aquabond 65. Chipping Specs: < 10mm
OUTLINE Table 1 Test Parameters Machine MTI NSS 612 Gang Wheels (5) Contact Aquabond for specific specs Size 4.5 x .005 x 3.5” Spindle Speed 9000 RPM Feedrate 0.5 IPM Gang Pitch .0601” Wheel Exposure .070” Material Quartz wafer, 25 x 25 x .17mm Material Orientation Coated-side up Depth of Cut .010” into glass Cut Direction Climb Cut Fixture Vacuum chuck Bonding Aquabond 65 Substrate Soda lime glass plate Coolant 19°C Syntilo/DI water, 2.5% conc. @ 2.0 GPM thru single .25” dia. nozzle RESULTS (3) passes were made in each direction to generate (196) parts per wafer. A wafer was test-cut and all parts were inspected. The results are shown in Table 2: Table 2 Test Results Specification Actual Max Edge Chipping (mm) < 10 10 (17)* * There were a total of (8) chips that measured between 10 and 17mm, over the entire array of (196) parts. However, typical max. chips were less than 10mm.
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